Shanghai, April 24, 2025 — ReinOCS Technology, together with CheLink Technology Co., Ltd. (“CheLink”), hosted the Launch Event for In-Vehicle Optical Communication Modules and Solutions at the 2025 Shanghai Auto Show. ReinOCS Chairman Ding Hai and CheLink Founder Yang Hongze attended the event, joined by representatives from leading domestic and international automakers, marking an important milestone in the evolution of automotive communication technology.

At the event, the two companies jointly introduced the Photonics-Electronics Convergence Solution and a new generation of high-bandwidth in-vehicle optical communication modules. As one of the industry’s most forward-looking technologies, the solution delivers higher data transmission rates, lightweight design, strong electromagnetic interference resistance, enhanced environmental adaptability, and superior system integration capabilities. These advantages provide a robust backbone for smart cockpit applications and autonomous driving, ensuring more stable and efficient data transmission.

 

Moreover, this breakthrough lays a solid technological foundation for next-generation intelligent electronic architectures that demand high bandwidth and enhanced security, accelerating the advancement of connected and intelligent mobility.